Semiconductor device and integrated circuit damage characteristics

(1) The damage of the secondary and triode is generally the breakdown or open circuit of the PN junction. Among them, the breakdown is mostly short. In addition, there are two kinds of damage performances, one is that the thermal stability is deteriorated, and the performance is normal at the time of starting, and after working for a while. Another type of soft breakdown occurs. The characteristics of the PN junction deteriorate. With the multimeter Rx 1K, each PN junction is normal, but it cannot work normally after being used. If the RX10 or RX1 low-range block is used, the NN junction will be found. The resistance value is larger than the normal value. Measuring the second and triode can be measured on the road with a pointer multimeter. The more accurate method is to set the multimeter to RX 10 or Rx1 (usually use RX10 block, then use Rx1 block when it is not obvious). Measure the PN junction of the second and the triode. To the resistance. If the forward resistance is not too large, "relative to normal value", the reverse resistance is large enough (relative to the positive value) to indicate that the PN junction is normal and vice versa. It is necessary to test after soldering. This is because of the general eMule. Second, the external resistance of the transistor is mostly in the hundreds or thousands of ohms. With the low resistance of the multimeter to block the amount of the line side, the influence of the peripheral resistance on the PN junction resistance can be basically ignored.

(2) Characteristics of damage. The internal structure of an integrated circuit has many complicated functions. Any part of the damage will not work properly. There are also two types of damage to the integrated circuit that are completely damaged and have poor thermal stability. When completely damaged. It can be removed. Compared with the normal same type of integrated circuit, the forward and reverse resistance of each pin to ground can always find that one or several of the pins have abnormal resistance. For poor thermal stability, the suspected integrated circuit can be cooled with absolute alcohol while the device is in operation, and can be determined if the time of failure is delayed or no longer occurs. It can usually only be eliminated by replacing a new integrated circuit.